Judged by the presence of artificial intelligence (AI) and machine learning (ML) technologies at 2023 Design Automation Conference (DAC), the premiere event for semiconductor designers, computing ...
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
Morning Overview on MSN
This new 3D chip could smash the 'memory wall' slowing AI
Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, but how fast it can feed itself data. The long-feared “memory wall” is now ...
What are the current challenges involved with incorporating sufficient HBM into multi-die design? How a new interconnect technology can address the performance, size, and power issues that could ...
With the Open Compute Project (OCP) Summit upon us, it’s an appropriate time to talk about chiplet interconnect (in fact the 2024 OCP Summit has a whole day dedicated to the multi-die topic, on ...
What if the future of artificial intelligence is being held back not by a lack of computational power, but by a far more mundane problem: memory? While AI’s computational capabilities have skyrocketed ...
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