When engineers at General Dynamics Armament and Technical Products (GDATP) recently designed the ammunition container for a new aircraft weapon system, they decided very early in the process to make ...
Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
Dow Automotive Systems (Horgen, Switzerland) made big news at JEC Europe 2014 with the introduction of VORAFORCE, its ultralow-viscosity, fast-cure epoxy for automotive molding. Since then, says Peter ...
MCM Composites announces its capabilities in thermoset insert molding, providing customers with components designed for strength, durability, and precision applications. The company’s thermoset insert ...
In this video, I create the world’s most expensive snail by carving a patterned block of wood into a snail shell and using ...
Bringing mass reduction capabilities to mass production facilities, Dow Automotive can now offer 90-second cycle times for resin transfer molding (RTM) with Voraforce 5300 resin matrix, making ...