Sunnyvale, Calif.—Spansion LLC, the Flash memory venture of AMD and Fujitsu Limited today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to ...

Geneva – STMicroelectronics (NYSE: STM), a leading supplier of non-volatile memory (NVM) for mobile phones, today announced the availability of memory solutions using Package-on-Package (PoP) ...

Spansion LLC, the Flash memory venture of AMD and Fujitsu Limited, today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, ...

Your next smartphone purchase might come with a new type of memory, depending on the model and when you buy it. That is because Samsung has begun mass producing what it claims is the industry's ...

Artificial intelligence has been bottlenecked less by raw compute than by how quickly models can move data in and out of memory. A new generation of memory-centric designs is starting to change that, ...

Intel has released a new package for stacking memory chips that will let manufacturers put more memory into cell phones without increasing the size of the handsets. The new package, called the ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now mass producing the industry’s first ePoP (embedded ...

Intel’s upcoming Meteor Lake processors will be the company’s first chips manufactured using a new Intel 4 process, which the company says will bring improvements in performance and efficiency.

Samsung' industry-first WSP is a 16Gbit memory solution that stacks eight 2Gb NAND chips. The WSP generates a much smaller multi-chip package (MCP), which is the current mainstream solution for ...

Recap: Intel named Sapphire Rapids the fourth generation of Xeon processor in 2019, and disclosed support for DDR5, PCIe 5.0, and in-package memory in the years since. But for all that, they've never ...

An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...

Spansion’s Solution Reduces Form Factors as Devices Adopt New Features Sunnyvale, Calif., -- September 12, 2005 --Spansion LLC, the Flash memory venture of AMD (NYSE:AMD) and Fujitsu Limited (TSE:6702 ...