As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...
In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...
Smaller is better when it comes to sterile device package design. The EtO package design is generally either a Tyvek lidded thermoform tray, a Tyvek-poly film pouch, or, for moisture- and ...
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