Aehr Test Systems (NASDAQ:AEHR) executives said the company made “significant progress” across both wafer-level and package-part burn-in markets during its fiscal 2026 second-quarter earnings call, ...
FREMONT, CA / ACCESS Newswire / August 26, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a purchase order from a ...
Despite a dip in revenue and margins, Aehr Test Systems (AEHR) secures key wins and forecasts strong future growth in AI processor testing.
FREMONT, CA / ACCESSWIRE / December 14, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...
Embedded test compression is a standard technique for dramatically reducing the test data volume and test time on the automatic test equipment. Companies typically aim for 60x to 100x compression for ...
Q2 2026 Management View CEO Gayn Erickson reported that "while second quarter revenue was softer than anticipated, we made significant progress in both wafer-level burn-in and packaged-part burn-in ...
Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix Designed to enhance the safety of operators and equipment; complies with regulations SANTA ROSA, ...
FREMONT, CA / ACCESSWIRE / April 2, 2024 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer order ...
Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...
Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and ...
In order to provide the chips required for this change in the landscape, there will be a large number of changing requirements in wafer test that come out of these architectural requirements. Form ...
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