Researchers from Regensburg and Birmingham have overcome a fundamental limitation of optical microscopy. With the help of quantum mechanical effects, they succeeded for the first time in performing ...
Researchers from the labs of Professors Vinayak Dravid and Omar Farha developed a high-resolution approach to map ...
Researchers at the California NanoSystems Institute at UCLA published a step-by-step framework for determining the ...
Abstract: Scanning acoustic microscopy (SAM) plays a critical role in nondestructive inspection of semiconductor and industrial materials; however, deep-layer SAM images often suffer from severe ...
Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...
Scanning Acoustic Microscopy (SAM) has become a critical non-destructive testing method for confirming high reliability in aerospace and defense applications by detecting hidden flaws and validating ...
Traditional ultrasonic imaging systems usually transmit broadband ultrasonic pulses through the full sample volume under study. By analyzing these pulses, researchers can measure sample thickness, ...
As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration ...
SAM uses high-frequency ultrasound to inspect and characterise internal features of materials, detecting cracks, voids, inclusions, and delaminations that could compromise performance. SAM is a ...
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